| Home : ADEKA Develops New Additive for Copper Plating: Single-component Additive for TSV Filling |
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Oct 11
2013 |
ADEKA Develops New Additive for Copper Plating: Single-component Additive for TSV Filling |
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TOKYO, Oct. 11, 2013 /PRNewswire/ -- ADEKA Corporation has developed a new single-component type additive for TSV (Through Silicone Via) copper plating that will bring a reduction in costs, prevent defects and is very versatile.
(http://www.adeka.co.jp/en/news/2013/pdf/131011.pdf)
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| Source:http://www.prnewswire.com/news-releases/adeka-develops-new-additive-for-copper-plating-single-component-additive-for-tsv-filling-227332111.html |
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