Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs

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Apr 21 2014	Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs
SAN JOSE, Calif. and HSINCHU, Taiwan, R.O.C., April 21, 2014 /PRNewswire/ -- Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to...


Source:http://www.prnewswire.com/news-releases/altera-and-tsmc-collaborate-to-bring-advanced-packaging-technology-to-arria-10-fpgas-and-socs-255965551.html

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