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| Home : Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging Technology Platform for MAX® 10 FPGA Products |
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Apr 07
2015 |
Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging Technology Platform for MAX® 10 FPGA Products |
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SAN JOSE, Calif. and HSINCHU, Taiwan, April 7, 2015 /PRNewswire/ -- Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have produced an innovative, UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package)... |
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| Source:http://www.prnewswire.com/news-releases/altera-and-tsmc-innovate-industry-first-ubm-free-wlcsp-packaging-technology-platform-for-max-10-fpga-products-300061741.html |
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