IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging

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Jul 06 2012	IBM and TEL NEXX Collaborate to Advance 3D Semiconductor Packaging
BILLERICA, Mass., July 5, 2012 /PRNewswire/ -- TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D semiconductor packaging with IBM. TEL NEXX has collaborated with IBM R&D for...


Source:http://www.prnewswire.com/news-releases/ibm-and-tel-nexx-collaborate-to-advance-3d-semiconductor-packaging-161520785.html

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