IMRA Agrees with DISCO to Jointly Develop Laser Dicing

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Mar 19 2012	IMRA Agrees with DISCO to Jointly Develop Laser Dicing
KARIYA, Japan, March 19, 2012 /PRNewswire/ -- IMRA America, Inc., a subsidiary of Aisin Seiki Co., Ltd., and DISCO Corporation have agreed to collaborate in the development of new lasers and processing systems for laser dicing of semiconductor materials. IMRA America has supplied several...


Source:http://www.prnewswire.com/news-releases/imra-agrees-with-disco-to-jointly-develop-laser-dicing-143280746.html

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