Nano Dimension Files Patent Application in U.S. for Combined Process for Simultaneous Curing and Sintering of Two Types of Ink

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Home : Nano Dimension Files Patent Application in U.S. for Combined Process for Simultaneous Curing and Sintering of Two Types of Ink

Apr 18 2016	Nano Dimension Files Patent Application in U.S. for Combined Process for Simultaneous Curing and Sintering of Two Types of Ink
NESS ZIONA, Israel, April 18, 2016 /PRNewswire/ -- Nano Dimension Ltd., a leader in the area of 3D Printed Electronics (NASDAQ, TASE: NNDM), announced today that its wholly owned subsidiary, Nano Dimension Technologies, has filed a patent application with the U.S....


Source:http://www.prnewswire.com/news-releases/nano-dimension-files-patent-application-in-us-for-combined-process-for-simultaneous-curing-and-sintering-of-two-types-of-ink-300252726.html

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