SMIC Announces Proposed Issue of US$500 Million 4.125% Bonds Due 2019

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Sep 26 2014	SMIC Announces Proposed Issue of US$500 Million 4.125% Bonds Due 2019
SHANGHAI, Sept. 25, 2014 /PRNewswire/ -- Semiconductor Manufacturing International Corporation (NYSE: SMI; SEHK: 981) ("SMIC" or "the Company") one of the leading semiconductor foundries in the world, announces that on 25 September 2014, SMIC and the Joint Lead...


Source:http://www.prnewswire.com/news-releases/smic-announces-proposed-issue-of-us500-million-4125-bonds-due-2019-277155061.html

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