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| Home : Top Quality Cu Diffusion Barriers from Picosun in the ENIAC JU Project ESiP |
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Jun 10
2013 |
Top Quality Cu Diffusion Barriers from Picosun in the ENIAC JU Project ESiP |
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ESPOO, Finland, June 9, 2013 /PRNewswire/ --
Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, reports excellent process results for copper diffusion barrier deposition. ALD materials for copper diffusion barriers were investigated in the project ESiP (Efficient... |
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| Source:http://www.prnewswire.com/news-releases/top-quality-cu-diffusion-barriers-from-picosun-in-the-eniac-ju-project-esip-210765941.html |
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