TSMC Tapes Out Foundry's First CoWoS™ Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface

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Oct 12 2012	TSMC Tapes Out Foundry's First CoWoS™ Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface
HSINCHU, Taiwan, R.O.C., Oct. 12, 2012 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) today announced that it has taped out the foundry segment's first CoWoS™ (Chip on Wafer on Substrate) test vehicle using JEDEC Solid State Technology Association's Wide I/O mobile DRAM...


Source:http://www.prnewswire.com/news-releases/tsmc-tapes-out-foundrys-first-cowos-test-vehicle-integrating-with-jedec-wide-io-mobile-dram-interface-173841141.html

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